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IPC standards are used worldwide. Using industry standards makes communications with your customers and suppliers easier. Standards assist manufacturability and
often incorporate industry best practices. Get familiar with IPC standards and make your job easier!
A sample of key IPC standards is shown below. Pricing, table of contents, available formats, and ordering information is all available at www.ipc.org/onlinestore.
DESIGN STANDARDS
IPC-2221A
Generic Standard on Printed Board Design IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic
requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or
multilayer. Among the many updates to Revision A are new criteria for surface plating, internal and external foil thicknesses, component placement and hole
tolerances. Expanded coverage is provided for material properties, dimensioning and tolerancing rules, and via structures as well as updated coupon designs for
quality assurance.
IPC-2222
Sectional Design Standard for Rigid Printed Boards used in conjunction with IPC-2221A, IPC-2222 establishes the specific requirements for the design of rigid
organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered
boards. Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters.
IPC-2223A
Sectional Design Standard for Flexible Printed Boards used in conjunction with IPC-2221A, IPC-2223 establishes the requirements for the design of single-sided,
double-sided, multilayer, or rigid-flex flexible circuits. Revision A includes updated design rules for panel sizes, hole spacing, bend radii, shielding,
palletization, nonfunctional lands, coverlayer access/spacing and conductor edge spacing.
IPC-2226
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards Designers and manufacturers looking for the next level of guidance on building high
density interconnect (HDI) boards will welcome IPC-2226. Used in conjunction with IPC-2221A, this standard establishes requirements and considerations for the
design of high density interconnect (HDI) printed boards and its forms of component mounting and interconnecting structures. Based on years of industry
manufacturing and design experience, the standard provides recommendations for signal, power, ground and mixed distribution layers, dielectric separation, via
formation and metallization requirements and other design features that are necessary for HDI-advanced IC interconnection substrates. Trade-off analyses required
to match the mounting structure to the selected chip set are included.
IPC-7351A
Generic Requirements for Surface Mount Design and Land Pattern Standard. The next revision to the industry's leading land pattern design standard is here! This
popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs,
QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems, and
three separate land pattern geometries for each component that allows the user to select a land pattern based on desired component density. Revision A now
includes land pattern design guidance for lead free soldering processes, reflow cycle and profile requirements for components, and new component families such as
numerous forms of chip array packages and "pull-back" QFN and SON devices. IPC-7351A includes both the standard and a IPC-7351A land pattern viewer on CD-ROM
from which to access component and land pattern dimensional data. 94 pages. Released February 2007.
PRINTED BOARDS AND MATERIALS
IPC-6011
Generic Performance Specification for Printed Boards. This specification establishes the general requirements and responsibilities for suppliers and users of
printed boards. Serving as the foundation for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance requirements that
must be met. For use with IPC-6012 through IPC-6018.
IPC-6012B with Amendment 1
Qualification and Performance Specification for Rigid Printed Boards. This specification covers qualification and performance of rigid printed boards, including
single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. Addresses final finish and
surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and
environmental requirements. Amendment 1 to Revision B incorporates new requirements for reduction of surface wrap copper plating and final finish requirements
for electroless nickel/immersion gold (ENIG) and immersion silver platings. For use with IPC-6011.
IPC-6013A
Qualification and Performance Specification for Flexible Printed Boards – Includes Amendment 2
Covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided,
double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, plated-through holes and blind/buried vias. This document
includes updated requirements for surface plating, microsection evaluations and acceptance testing frequency. For use with IPC-6011.
IPC-A-600G
Acceptability of Printed Boards. The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and
illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your
operators, inspectors, and engineers have the most current industry consensus information. With more than 80 new or revised photographs and illustrations,
revision G provides new coverage on topics such as smear removal, lifted lands and wire bond pads along with updated and expanded coverage for measling and
crazing of printed boards, annular ring requirements, etchback, foil cracks, flexible circuits, and minimum foil thickness for conductive patterns. The document
sychronizes to the acceptability requirements expressed in IPC-6012B and IPC-6013A.
IPC-4101B
Specification for Base Materials for Rigid and Multilayer Printed Boards – Includes Amendments 1 & 2
This specification covers the requirements for base materials (laminate and prepreg) for rigid or multilayer printed boards for electrical and electronic
circuits. This document contains more than 50 specification sheets and uses search terms to allow the user to find similar groups of materials from these
specification sheets. This standard provides the user with additional information and data on printed circuit board materials that are better able to withstand
the newer assembly operations employing higher thermal exposures, including those that use lead free solders.
IPC-4562
Metal Foil for Printed Wiring Applications with Amendment 1. IPC-4562 covers the nomenclature and requirements for metal foils used in laminate and board
fabrication. Specification sheets are included to assist buyers and suppliers in understanding and using consistent purchasing and quality criteria for metal
foils.
ELECTRONIC ASSEMBLY
IPC-J-STD-001D
Requirements for Solder Electrical and Electronic Assemblies. J-STD-001D is recognized worldwide as the sole industry-consensus standard for soldering materials
and processes. This document includes support for lead free manufacturing, in addition to criteria for materials, methods and verification for producing quality
soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity.
This standard fully complements IPC-A-610D.
IPC-A-610D
Acceptability of Electronic Assemblies. IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and
assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations.
Topics include lead free, component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning,
marking, coating, and laminate requirements. This 400-page document synchronizes to the requirements expressed in other industry consensus documents and is used
with the material and process standard IPC J-STD-001.
IPC-7095A
Design and Assembly Process Implementation for BGAs. Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique
challenges for design, assembly, inspection and repair personnel. This document delivers useful and practical information to anyone who is currently using BGAs
or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection and repair, IPC-7095A also addresses
reliability issues and the use of lead free joint criteria associated with BGAs. The document includes many photographs of X-ray or endoscope illustrations to
identify characteristics that the industry is experiencing in the implementation of BGA assembly processes. The effect of BGA and FBGA on current technology and
component types is also discussed.
Find out more at www.ipc.org today!
often incorporate industry best practices. Get familiar with IPC standards and make your job easier!
A sample of key IPC standards is shown below. Pricing, table of contents, available formats, and ordering information is all available at www.ipc.org/onlinestore.
DESIGN STANDARDS
IPC-2221A
Generic Standard on Printed Board Design IPC-2221A is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic
requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or
multilayer. Among the many updates to Revision A are new criteria for surface plating, internal and external foil thicknesses, component placement and hole
tolerances. Expanded coverage is provided for material properties, dimensioning and tolerancing rules, and via structures as well as updated coupon designs for
quality assurance.
IPC-2222
Sectional Design Standard for Rigid Printed Boards used in conjunction with IPC-2221A, IPC-2222 establishes the specific requirements for the design of rigid
organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered
boards. Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters.
IPC-2223A
Sectional Design Standard for Flexible Printed Boards used in conjunction with IPC-2221A, IPC-2223 establishes the requirements for the design of single-sided,
double-sided, multilayer, or rigid-flex flexible circuits. Revision A includes updated design rules for panel sizes, hole spacing, bend radii, shielding,
palletization, nonfunctional lands, coverlayer access/spacing and conductor edge spacing.
IPC-2226
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards Designers and manufacturers looking for the next level of guidance on building high
density interconnect (HDI) boards will welcome IPC-2226. Used in conjunction with IPC-2221A, this standard establishes requirements and considerations for the
design of high density interconnect (HDI) printed boards and its forms of component mounting and interconnecting structures. Based on years of industry
manufacturing and design experience, the standard provides recommendations for signal, power, ground and mixed distribution layers, dielectric separation, via
formation and metallization requirements and other design features that are necessary for HDI-advanced IC interconnection substrates. Trade-off analyses required
to match the mounting structure to the selected chip set are included.
IPC-7351A
Generic Requirements for Surface Mount Design and Land Pattern Standard. The next revision to the industry's leading land pattern design standard is here! This
popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs,
QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems, and
three separate land pattern geometries for each component that allows the user to select a land pattern based on desired component density. Revision A now
includes land pattern design guidance for lead free soldering processes, reflow cycle and profile requirements for components, and new component families such as
numerous forms of chip array packages and "pull-back" QFN and SON devices. IPC-7351A includes both the standard and a IPC-7351A land pattern viewer on CD-ROM
from which to access component and land pattern dimensional data. 94 pages. Released February 2007.
PRINTED BOARDS AND MATERIALS
IPC-6011
Generic Performance Specification for Printed Boards. This specification establishes the general requirements and responsibilities for suppliers and users of
printed boards. Serving as the foundation for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance requirements that
must be met. For use with IPC-6012 through IPC-6018.
IPC-6012B with Amendment 1
Qualification and Performance Specification for Rigid Printed Boards. This specification covers qualification and performance of rigid printed boards, including
single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. Addresses final finish and
surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and
environmental requirements. Amendment 1 to Revision B incorporates new requirements for reduction of surface wrap copper plating and final finish requirements
for electroless nickel/immersion gold (ENIG) and immersion silver platings. For use with IPC-6011.
IPC-6013A
Qualification and Performance Specification for Flexible Printed Boards – Includes Amendment 2
Covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided,
double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, plated-through holes and blind/buried vias. This document
includes updated requirements for surface plating, microsection evaluations and acceptance testing frequency. For use with IPC-6011.
IPC-A-600G
Acceptability of Printed Boards. The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and
illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your
operators, inspectors, and engineers have the most current industry consensus information. With more than 80 new or revised photographs and illustrations,
revision G provides new coverage on topics such as smear removal, lifted lands and wire bond pads along with updated and expanded coverage for measling and
crazing of printed boards, annular ring requirements, etchback, foil cracks, flexible circuits, and minimum foil thickness for conductive patterns. The document
sychronizes to the acceptability requirements expressed in IPC-6012B and IPC-6013A.
IPC-4101B
Specification for Base Materials for Rigid and Multilayer Printed Boards – Includes Amendments 1 & 2
This specification covers the requirements for base materials (laminate and prepreg) for rigid or multilayer printed boards for electrical and electronic
circuits. This document contains more than 50 specification sheets and uses search terms to allow the user to find similar groups of materials from these
specification sheets. This standard provides the user with additional information and data on printed circuit board materials that are better able to withstand
the newer assembly operations employing higher thermal exposures, including those that use lead free solders.
IPC-4562
Metal Foil for Printed Wiring Applications with Amendment 1. IPC-4562 covers the nomenclature and requirements for metal foils used in laminate and board
fabrication. Specification sheets are included to assist buyers and suppliers in understanding and using consistent purchasing and quality criteria for metal
foils.
ELECTRONIC ASSEMBLY
IPC-J-STD-001D
Requirements for Solder Electrical and Electronic Assemblies. J-STD-001D is recognized worldwide as the sole industry-consensus standard for soldering materials
and processes. This document includes support for lead free manufacturing, in addition to criteria for materials, methods and verification for producing quality
soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity.
This standard fully complements IPC-A-610D.
IPC-A-610D
Acceptability of Electronic Assemblies. IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and
assembly departments, IPC-A-610D illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations.
Topics include lead free, component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning,
marking, coating, and laminate requirements. This 400-page document synchronizes to the requirements expressed in other industry consensus documents and is used
with the material and process standard IPC J-STD-001.
IPC-7095A
Design and Assembly Process Implementation for BGAs. Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique
challenges for design, assembly, inspection and repair personnel. This document delivers useful and practical information to anyone who is currently using BGAs
or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection and repair, IPC-7095A also addresses
reliability issues and the use of lead free joint criteria associated with BGAs. The document includes many photographs of X-ray or endoscope illustrations to
identify characteristics that the industry is experiencing in the implementation of BGA assembly processes. The effect of BGA and FBGA on current technology and
component types is also discussed.
Find out more at www.ipc.org today!